27 Patents
- 0 cites
- US124697972025Electronic Component Module Comprising Plurality of Components and Substrate Including Insulating Layer, Ground Layer and Ground Bump
MURATA MANUFACTURING CO., Ltd.
0 cites - 0 cites
- US124127942025Module Having a Changing Filler Content Rate in Sealing Resin Layer
MURATA MANUFACTURING CO., Ltd.
0 cites - 0 cites
- 0 cites
- 0 cites
- US123288572025Electronic Component Module and Method of Manufacturing Electronic Component Module
MURATA MANUFACTURING CO., Ltd.
0 cites - 0 cites
- US123099322025Electronic Component Module, Sub-module, and Method for Manufacturing Same
MURATA MANUFACTURING CO., Ltd.
0 cites - 0 cites
- US122679642025Electronic Component Module and Method for Manufacturing Electronic Component Module
MURATA MANUFACTURING CO., Ltd.
0 cites - 0 cites
- US122438582025Electronic Component Module, and Method of Manufacturing Electronic Component Module
MURATA MANUFACTURING CO., Ltd.
0 cites - US122453632025Electronic Component Module, and Method of Manufacturing the Same
MURATA MANUFACTURING CO., Ltd.
0 cites - 0 cites
- US122242492025Package Module Comprising Marking and Shield Films and Method of Manufacturing the Same
MURATA MANUFACTURING CO., Ltd.
0 cites - 0 cites
- 0 cites
- 0 cites
- US121130302024Electronic Component Module Comprising Shield and Sealing Resin Covering Electronic Components
MURATA MANUFACTURING CO., Ltd.
0 cites - US120877012024Package Module Comprising Shield Film on Semiconductor Device and Method of Manufacturing the Same
MURATA MANUFACTURING CO., Ltd.
0 cites - 0 cites
- 0 cites
- 0 cites
- 0 cites
- US116825972023Module with Built-in Component and Method for Manufacturing the Same
MURATA MANUFACTURING CO., Ltd.
0 cites