Swee Kah Lee

6 Patents

• US125507512026

  Flip Chip Bonding for Semiconductor Packages Using Metal Strip

  Infineon Technologies AG

  0 cites
• US122323022025

  Dipped Coated Electronic Module Assembly with Enhanced Thermal Distribution

  Infineon Technologies Austria AG

  0 cites
• US122180382025

  Leadframe, Semiconductor Package and Method

  Infineon Technologies Austria AG

  0 cites
• US121762222024

  Semiconductor Package with Metal Posts from Structured Leadframe

  Infineon Technologies AG

  0 cites
• US117911692023

  Dual Step Laser Processing of an Encapsulant of a Semiconductor Chip Package

  INFINEON TECHNOLOGIES AG

  0 cites
• US116826442023

  Semiconductor Device with a Heterogeneous Solder Joint and Method for Fabricating the Same

  Infineon Technologies AG

  0 cites