Patents/Inventors

Swadesh Choudhary

Mountain View, CAUS30 patents

28 Patents

US125917272026
Lane Repair and Lane Reversal Implementation for Die-to-die (D2D) Interconnects
Intel Corporation
0 cites
US125783842026
Unified Test and Debug Chiplet Architecture
Intel Corporation
0 cites
US125546722026
Link Layer-phy Interface Adapter
Intel Corporation
0 cites
US125050652025
On-package Die-to-die (D2D) Interconnect for Memory Using Universal Chiplet Interconnect Express (ucie) PHY
Intel Corporation
0 cites
US124990192025
Retimers to Extend a Die-to-die Interconnect
Intel Corporation
0 cites
US124990742025
Die-to-die Interconnect Protocol Layer
Intel Corporation
0 cites
US124816142025
Standard Interfaces for Die to Die (D2D) Interconnect Stacks
Intel Corporation
0 cites
US124685972025
Valid Signal for Latency Sensitive Die-to-die (D2D) Interconnects
Intel Corporation
0 cites
US124572712025
System, Apparatus and Method for Handling Multi-protocol Traffic in Data Link Layer Circuitry
Intel Corporation
0 cites
US124059122025
Link Initialization Training and Bring Up for Die-to-die Interconnect
Intel Corporation
0 cites
US123732792025
Selection of Processing Mode for Receiver Circuit
Intel Corporation
0 cites
US123609342025
Parameter Exchange for a Die-to-die Interconnect
Intel Corporation
0 cites
US123623062025
Clock-gating in Die-to-die (D2D) Interconnects
Intel Corporation
0 cites
US123533052025
Compliance and Debug Testing of a Die-to-die Interconnect
Intel Corporation
0 cites
US123327522025
Hardware Logging for Lane Margining and Characterization
Intel Corporation
0 cites
US123328262025
Die-to-die Interconnect
Intel Corporation
0 cites
US123213052025
Sideband Interface for Die-to-die Interconnects
Intel Corporation
0 cites
US122988332025
Performance Level Control in a Data Processing Apparatus
Intel Corporation
0 cites
US122443262025
Encoder and Decoder of Forward Error Correction (FEC) Codec
Intel Corporation
0 cites
US122228812025
Logical Physical Layer Interface Specification Support for Pcie 6.0, Cxl 3.0, and UPI 3.0 Protocols
INTEL CORPORATION
0 cites
US121894702025
Forward Error Correction and Cyclic Redundancy Check Mechanisms for Latency-critical Coherency and Memory Interconnects
Intel Corporation
0 cites
US121117832024
Flexible On-die Fabric Interface
Intel Corporation
0 cites
US120325002024
System, Apparatus and Method for Controlling Traffic in a Fabric
Intel Corporation
0 cites
US119718412024
Link Layer-phy Interface Adapter
Intel Corporation
0 cites
US118180582023
Shared Resources for Multiple Communication Traffics
Intel Corporation
0 cites
US117701382023
Encoder and Decoder of Forward Error Correction (FEC) Codec
Intel Corporation
0 cites
US117628022023
Streaming Fabric Interface
Intel Corporation
0 cites
US116988792023
Flexible On-die Fabric Interface
Intel Corporation
0 cites