Susumu Maniwa

4 Patents

• US124566972025

  Multilayer Wiring Substrate and Module Having Multilayer Wiring Substrate

  TOPPAN Inc.

  0 cites
• US123174112025

  Glass Core Wiring Substrate Incorporating High-frequency Filter, High-frequency Module Using the Same, and Method of Manufacturing Glass Core Wiring Substrate Incorporating High-frequency Filter

  TOPPAN Inc.

  0 cites
• US121010742024

  Multilayer Circuit Board with LC Resonant Circuit and Electronic Component Package Including Multilayer Circuit Board with LC Resonant Circuit

  TOPPAN Inc.

  0 cites
• US118773942024

  Glass Core Multilayer Wiring Board and Method of Producing the Same

  TOPPAN Inc.

  0 cites