Patents/Inventors

Susumu Baba

IbarakiJP1 patent

2 Patents

US121395762024
Curable Resin Composition, Adhesive Agent, Adhesive Film, Circuit Substrate, Interlayer Insulating Material, and Printed Wiring Board
SEKISUI CHEMICAL CO., Ltd.
0 cites
US118733982024
Interlayer Insulating Material and Multilayer Printed Wiring Board
SEKISUI CHEMICAL CO., Ltd.
0 cites