Patents/Inventors

Susmriti Das Mahapatra

Tempe, AZUS2 patents

3 Patents

US121660042024
Solder Thermal Interface Material (STIM) with Dopant
Intel Corporation
0 cites
US120402462024
Chip-scale Package Architectures Containing a Die Back Side Metal and a Solder Thermal Interface Material
Intel Corporation
0 cites
US118173692023
Lids for Integrated Circuit Packages with Solder Thermal Interface Materials
Intel Corporation
0 cites