Patents/Inventors

Susmit Singha Roy

Campbell, CAUS24 patents

24 Patents

US126107912026
Method of Forming Carbon-based Spacer for EUV Photoresist Patterns
Applied Materials, Inc.
0 cites
US124380502025
Electronic Device Fabrication Using Area-selective Deposition
Applied Materials, Inc.
0 cites
US123946702025
Nucleation-free Gap Fill ALD Process
Applied Materials, Inc.
0 cites
US123810862025
Low Temperature Graphene Growth
Applied Materials, Inc.
0 cites
US123004912025
Deposition of Semiconductor Integration Films
Applied Materials, Inc.
0 cites
US122887172025
Metal Based Hydrogen Barrier
Applied Materials, Inc.
0 cites
US121989362025
Defect Free Germanium Oxide Gap Fill
Applied Materials, Inc.
0 cites
US121105842024
Low Temperature Growth of Transition Metal Chalcogenides
Applied Materials, Inc.
0 cites
US120847642024
Vapor Phase Photoresists Deposition
Applied Materials, Inc.
0 cites
US120464682024
Conformal Silicon-germanium Film Deposition
Applied Materials, Inc.
0 cites
US120183642024
Super-conformal Germanium Oxide Films
Applied Materials, Inc.
0 cites
US120209822024
Metal Based Hydrogen Barrier
Applied Materials, Inc.
0 cites
US119903692024
Selective Patterning with Molecular Layer Deposition
Applied Materials, Inc.
0 cites
US119729402024
Area Selective Carbon-based Film Deposition
Applied Materials, Inc.
0 cites
US118861202024
Deposition of Semiconductor Integration Films
Applied Materials, Inc.
0 cites
US118307342023
Thermal Deposition of Silicon-germanium
Applied Materials, Inc.
0 cites
US118173202023
CVD Based Oxide-metal Multi Structure for 3D NAND Memory Devices
Applied Materials, Inc.
0 cites
US117911552023
Diffusion Barriers for Germanium
Applied Materials, Inc.
0 cites
US117812182023
Defect Free Germanium Oxide Gap Fill
APPLIED MATERIALS, Inc.
0 cites
US117567852023
Molecular Layer Deposition Contact Landing Protection for 3D NAND
Applied Materials, Inc.
0 cites
US117053352023
Conformal High Concentration Boron Doping of Semiconductors
Applied Materials, Inc.
0 cites
US115944152023
PECVD Tungsten Containing Hardmask Films and Methods of Making
Applied Materials, Inc.
0 cites
US115629042023
Deposition of Semiconductor Integration Films
Applied Materials, Inc.
0 cites
US115455042023
Methods and Apparatus for Three Dimensional NAND Structure Fabrication
APPLIED MATERIALS, Inc.
0 cites