Suresh Ramalingam

8 Patents

• US125640522026

  Chip Package with Pass Through Heat Spreader

  XILINX, Inc.

  0 cites
• US124631432025

  Chip Package with Core Embedded Integrated Devices

  XILINX, Inc.

  0 cites
• US123241012025

  Frame for Coupling of a Thermal Management Device to a Printed Circuit Board

  Advanced Micro Devices, Inc.

  0 cites
• US123157812025

  Heat Spreader for a Semiconductor Package

  XILINX, Inc.

  0 cites
• US121366132024

  Chip Package with Near-die Integrated Passive Device

  XILINX, Inc.

  0 cites
• US120274932024

  Fanout Integration for Stacked Silicon Package Assembly

  XILINX, Inc.

  0 cites
• US117697102023

  Heterogeneous Integration Module Comprising Thermal Management Apparatus

  XILINX, Inc.

  0 cites
• US116058862023

  Radome with Integrated Passive Cooling

  XILINX, Inc.

  0 cites