Patents/Inventors

Sunkyoung Seo

Suwon-siKR19 patents

17 Patents

US125819312026
Semiconductor Package and Method of Manufacturing the Same
Samsung Electronics Co., Ltd.
0 cites
US124009802025
Semiconductor Package
Samsung Electronics Co., Ltd.
0 cites
US123811852025
Semiconductor Packages
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US123623442025
Semiconductor Package and Method of Manufacturing the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US120876962024
Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US120210732024
Semiconductor Package and Method of Manufacturing the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US119488512024
Semiconductor Package Including High Thermal Conductivity Layer
Samsung Electronics Co., Ltd.
0 cites
US119424462024
Semiconductor Package and Method of Manufacturing the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US119358732024
Methods of Inspection of Semiconductor Packages Including Measurement of Alignment Accuracy Among Semiconductor Chips
Samsung Electronics Co., Ltd.
0 cites
US119233422024
Semiconductor Package
Samsung Electronics Co., Ltd.
0 cites
US118698182024
Chip-stacked Semiconductor Package and Method of Manufacturing Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US118482932023
Semiconductor Package
Samsung Electronics Co., Ltd.
0 cites
US117769412023
Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US117355662023
Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US117107572023
Semiconductor Package and Method of Fabricating the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US116212502023
Semiconductor Packages
Samsung Electronics Co., Ltd.
0 cites
US115748732023
Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites