7 Patents
- US125909002026Wafer Inspection Apparatus Using Three-dimensional Image and Method of Inspecting Wafer Using the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - US125784672026Light Detection and Ranging (lidar)-based Inspection Device and Method of Manufacturing Semiconductor Device
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - US124742602025Terahertz Signal Measuring Apparatus and Measuring Method
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - US123859462025Method of Inspecting Tip of Atomic Force Microscope and Method of Manufacturing Semiconductor Device
KOREA ADVANCED INSTITUTE OF SCIENCE AND Technology
0 cites - 0 cites
- US119884952024Through-focus Image-based Metrology Device, Operation Method Thereof, and Computing Device for Executing the Operation
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - US119212702024Inspection System Including Reference Specimen and Method of Forming Semiconductor Device
SAMSUNG ELECTRONICS CO., Ltd.
0 cites