4 Patents
- US125047472025Multicomponent Module Design and Fabrication
International Business Machines Corporation
0 cites - US124682932025Multicomponent Module Design and Fabrication
International Business Machines Corporation
0 cites - US122665982025Dense via Pitch Interconnect to Increase Wiring Density
International Business Machines Corporation
0 cites - US116583782023Vertically Transitioning Between Substrate Integrated Waveguides (siws) Within a Multilayered Printed Circuit Board (PCB)
INTERNATIONAL BUSINESS MACHINES CORPORATION
0 cites