Patents/Inventors

Sungeun Jo

Hwaseong-siKR4 patents

3 Patents

US125060472025
Semiconductor Package and Cooling System
Samsung Electronics Co., Ltd.
0 cites
US124314032025
Semiconductor Package Including Thermal Interface Material (TIM) Layers on Semiconductor Chips
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US123880482025
Semiconductor Package Comprising Heat Spreader
Samsung Electronics Co., Ltd.
0 cites