16 Patents
- US125820112026Device Including First Structure Having Peripheral Circuit and Second Structure Having Gate Layers
Samsung Electronics Co., Ltd.
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- US121836802024Semiconductor Memory Device Including Wiring Contact Plugs
Samsung Electronics Co., Ltd.
0 cites - 0 cites
- US120963192024Method by Which First Device Transmits Message in Wireless Communication System Supporting Sidelink, and Device Therefor
LG ELECTRONICS Inc.
0 cites - US119904502024Device Including First Structure Having Peripheral Circuit and Second Structure Having Gate Layers
Samsung Electronics Co., Ltd.
0 cites - US119012972024Semiconductor Memory Device Including Wiring Contact Plugs
Samsung Electronics Co., Ltd.
0 cites - US118482852023Semiconductor Chip Including Buried Dielectric Pattern at Edge Region, Semiconductor Package Including the Same, and Method of Fabricating the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - 0 cites
- US117988662023Semiconductor Device Including via Structures with Undercut Portions and Semiconductor Package Including the Same
SAMSUNG ELECTRONICS CO, Ltd.
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- US117354982023Through via Electrode and Device Isolation Structure Including Oxide Layer Pattern and Nitride Layer Pattern Sequentially Stacked on Inner Surface of Trench
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - 0 cites
- US115691712023Semiconductor Memory Device Including Wiring Contact Plugs
Samsung Electronics Co., Ltd.
0 cites