Patents/Inventors

Sung-kun Lin

Nanjing CityCN6 patents

3 Patents

US125990032026
Manufacturing Method of Package Substrate
Aaltosemi Inc.
0 cites
US125576642026
Electronic Package and Fabricating Method Thereof
Aaltosemi Inc.
0 cites
US125507962026
Electronic Package and Fabricating Method Thereof
Aaltosemi Inc.
0 cites