5 Patents
- US124944142025Semiconductor Device with Through-mold Via
Amkor Technology Singapore Holding Pte. Ltd.
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- US118698292024Semiconductor Device with Through-mold Via
Amkor Technology Singapore Holding Pte. Ltd.
0 cites - US117353962023Inductively Coupled Plasma Processing Apparatus
PUSAN NATIONAL UNIVERSITY INDUSTRY-UNIVERSITY COOPERATION FOUNDATION
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