Patents/Inventors

Sung Bok Lee

Itasca, ILUS2 patents

4 Patents

US117876882023
Methods of Forming MEMS Diaphragms Including Corrugations
KNOWLES ELECTRONICS, LLC
0 cites
US117876902023
MEMS Assembly Substrates Including a Bond Layer
KNOWLES ELECTRONICS, LLC.
0 cites
US116717662023
Microphone Device with Ingress Protection
KNOWLES ELECTRONICS, LLC.
0 cites
US116170422023
Acoustic Transducers with a Low Pressure Zone and Diaphragms Having Enhanced Compliance
KNOWLES ELECTRONICS, LLC.
0 cites