Sun Chul Kim

4 Patents

• US126160472026

  Method of Fabricating a Semiconductor Package Including an Interposer

  SAMSUNG ELECTRONICS CO., Ltd.

  0 cites
• US118625702024

  Semiconductor Package

  SAMSUNG ELECTRONICS CO., Ltd.

  0 cites
• US115629652023

  Semiconductor Package

  SAMSUNG ELECTRONICS CO., Ltd.

  0 cites
• US115454582023

  Semiconductor Package

  SAMSUNG ELECTRONICS CO., Ltd.

  0 cites