Sukwon Lee

3 Patents

• US118483012023

  Method of Manufacturing a Semiconductor Package

  SAMSUNG ELECTRONICS CO., Ltd.

  0 cites
• US116263812023

  Bonding Head Including a Thermal Compensator, Die Bonding Apparatus Including the Same and Method of Manufacturing Semiconductor Package Using the Same

  SAMSUNG ELECTRONICS CO., Ltd.

  0 cites
• US116077412023

  Semiconductor Chip Bonding Apparatus Including Head Having Thermally Conductive Materials

  SAMSUNG ELECTRONICS CO., Ltd.

  0 cites