13 Patents
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- US125325382026Integrated Circuit Structures Having Conductive Structures in Fin Isolation Regions
Intel Corporation
0 cites - US125060752025Epitaxial Source/drain Back-side Device Contact Structures with Wrap Around Metallization and Protective Conformal Liner
Intel Corporation
0 cites - US125060592025Vertically Spaced Intra-level Interconnect Line Metallization for Integrated Circuit Devices
Intel Corporation
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- US124697802025Integrated Circuit Structure with Recessed Self-aligned Deep Boundary Via
Intel Corporation
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- US120516922024Integrated Circuit Structure with Front Side Signal Lines and Backside Power Delivery
Intel Corporation
0 cites - US119488742024Vertically Spaced Intra-level Interconnect Line Metallization for Integrated Circuit Devices
Intel Corporation
0 cites - US117642192023Metal Space Centered Standard Cell Architecture to Enable Higher Cell Density
Intel Corporation
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