24 Patents
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- US122438122025Alternative Surfaces for Conductive Pad Layers of Silicon Bridges for Semiconductor Packages
Intel Corporation
0 cites - US122180632025EMIB Architecture with Dedicated Metal Layers for Improving Power Delivery
Intel Corporation
0 cites - US121702532024Metal-free Frame Design for Silicon Bridges for Semiconductor Packages
Intel Corporation
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- US121425532024Guard Ring Design Enabling In-line Testing of Silicon Bridges for Semiconductor Packages
Intel Corporation
0 cites - US121130262024Multi-chip Package and Method of Providing Die-to-die Interconnects in Same
Intel Corporation
0 cites - US120741212024Metal-free Frame Design for Silicon Bridges for Semiconductor Packages
Intel Corporation
0 cites - US120574132024Package Design Scheme for Enabling High-speed Low-loss Signaling and Mitigation of Manufacturing Risk and Cost
Intel Corporation
0 cites - US120448882024Silicon Groove Architectures and Manufacturing Processes for Passive Alignment in a Photonics Die
Intel Corporation
0 cites - US120465682024Capacitor Die Embedded in Package Substrate for Providing Capacitance to Surface Mounted Die
Intel Corporation
0 cites - US118760532024Multi-chip Package and Method of Providing Die-to-die Interconnects in Same
Intel Corporation
0 cites - US118482592023Alternative Surfaces for Conductive Pad Layers of Silicon Bridges for Semiconductor Packages
Intel Corporation
0 cites - US118240082023Multi-chip Package and Method of Providing Die-to-die Interconnects in Same
Intel Corporation
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- US117282942023Capacitor Die Embedded in Package Substrate for Providing Capacitance to Surface Mounted Die
Intel Corporation
0 cites - 0 cites
- US116768892023Guard Ring Design Enabling In-line Testing of Silicon Bridges for Semiconductor Packages
Intel Corporation
0 cites - US116263722023Metal-free Frame Design for Silicon Bridges for Semiconductor Packages
Intel Corporation
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