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Sue Yun Teng
Belmont, CA
US
3 patents
5 Patents
US12424509
2025
Compliant Pad Spacer for Three-dimensional Integrated Circuit Package
Google LLC
0 cites
US12243804
2025
Cooling Heatshield for Clamshell BGA Rework
Google LLC
0 cites
US11791231
2023
Compression-loaded Printed Circuit Assembly for Solder Defect Mitigation
Google LLC
0 cites
US11791239
2023
Cooling Heatshield for Clamshell BGA Rework
Google LLC
0 cites
US11756851
2023
Compression-loaded Printed Circuit Assembly for Solder Defect Mitigation
Google LLC
0 cites