11 Patents
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- US125506982026Via Profile Shrink for Advanced Integrated Circuit Structure Fabrication
Intel Corporation
0 cites - US123693992025Gate-to-gate Isolation for Stacked Transistor Architecture via Selective Dielectric Deposition Structure
INTEL CORPORATION
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- US122495772025Cap Structure for Interconnect Dielectrics and Methods of Fabrication
Intel Corporation
0 cites - 0 cites
- US120876142024Gap Fill Dielectrics for Electrical Isolation of Transistor Structures in the Manufacture of Integrated Circuits
Intel Corporation
0 cites - 0 cites
- US118942702024Grating Replication Using Helmets and Topographically-selective Deposition
Intel Corporation
0 cites - US118943682024Gate-all-around Integrated Circuit Structures Fabricated Using Alternate Etch Selective Material
Intel Corporation
0 cites - 0 cites