22 Patents
- US126222942026Methods and Apparatus to Improve Signal Integrity Performance in Integrated Circuit Packages
Intel Corporation
0 cites - US125754272026Defect-free Through Glass via Metallization Implementing a Sacrificial Resist Thinning Material
Intel Corporation
0 cites - US125688172026Surface Functionalization of Sinx Thin Film by Wet Etching for Improved Adhesion of Metal-dielectric for HSIO
Intel Corporation
0 cites - US125435782026Electronic Packaging Architecture with Customized Variable Metal Thickness on Same Buildup Layer
Intel Corporation
0 cites - 0 cites
- US124761752025Glass Substrates Having Transverse Capacitors for Use with Semiconductor Packages and Related Methods
Intel Corporation
0 cites - US124128682025Microelectronic Assemblies Including Interconnects with Different Solder Materials
Intel Corporation
0 cites - 0 cites
- US122551472025Electronic Substrate Having an Embedded Etch Stop to Control Cavity Depth in Glass Layers Therein
Intel Corporation
0 cites - 0 cites
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- US120741022024Structural Elements for Application Specific Electronic Device Packages
Intel Corporation
0 cites - US120339302024Selectively Roughened Copper Architectures for Low Insertion Loss Conductive Features
Intel Corporation
0 cites - 0 cites
- US120027452024High Performance Integrated RF Passives Using Dual Lithography Process
Intel Corporation
0 cites - US119488482024Subtractive Etch Resolution Implementing a Functional Thin Metal Resist
Intel Corporation
0 cites - US119423342024Microelectronic Assemblies Having Conductive Structures with Different Thicknesses
Intel Corporation
0 cites - 0 cites
- US117216502023Method for Fabricating Multiplexed Hollow Waveguides of Variable Type on a Semiconductor Package
Intel Corporation
0 cites - 0 cites
- US116580552023Customizable Release Layers to Enable Low Warpage Architectures for Advanced Packaging Applications
Intel Corporation
0 cites - US115749932023Package Architecture with Tunable Magnetic Properties for Embedded Devices
Intel Corporation
0 cites