11 Patents
- US126160462026Wafer Bonding Incorporating Thermal Conductive Paths
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites - US125507062026Interconnect Structure and Method of Forming Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US122550952025Semiconductor Structure and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US122117662025Highly Protective Wafer Edge Sidewall Protection Layer
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites - US121989792025Semiconductor Device with Multi-layer Etch Stop Structure
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US121598302024Nitrogen Plasma Treatment for Improving Interface Between Etch Stop Layer and Copper Interconnect
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites - US120949302024Integrated Circuit Structure and Method for Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US120465572024Interconnect Structure and Method of Forming Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US119233042024Electro-migration Barrier for Interconnect
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US118482312023Method for Forming Semiconductor Device with Multi-layer Etch Stop Structure
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US116705462023Semiconductor Structure and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites