Patents/Inventors

Steven M. Zuniga

Soquel, CAUS44 patents

43 Patents

US126222172026
High Throughput Polishing Modules and Modular Polishing Systems
Applied Materials, Inc.
0 cites
US126058022026
Condensed Gas Pad Conditioner
Applied Materials, Inc.
0 cites
US126057662026
Methods for Upper Platen Manufacturing
Applied Materials, Inc.
0 cites
US124475792025
Chemical Mechanical Polishing Vibration Measurement Using Optical Sensor
Applied Materials, Inc.
0 cites
US124343482025
Retaining Ring Having Inner Surfaces with Features
Applied Materials, Inc.
0 cites
US124008922025
High Throughput Polishing Modules and Modular Polishing Systems
Applied Materials, Inc.
0 cites
US123946512025
High Throughput Polishing Modules and Modular Polishing Systems
Applied Materials, Inc.
0 cites
US123650602025
Chemical Mechanical Polishing Correction Tool
Applied Materials, Inc.
0 cites
US123374392025
Multiple Disk Pad Conditioner
Applied Materials, Inc.
0 cites
US123302622025
Dual Membrane Carrier Head for Chemical Mechanical Polishing
Applied Materials, Inc.
0 cites
US123082722025
High Throughput Polishing Modules and Modular Polishing Systems
Applied Materials, Inc.
0 cites
US122517882025
Polishing Head with Local Wafer Pressure
APPLIED MATERIALS, Inc.
0 cites
US122517872025
Modular Chemical Mechanical Polisher with Simultaneous Polishing and Pad Treatment
Applied Materials, Inc.
0 cites
US122144692025
Polishing Head Retaining Ring Tilting Moment Control
Applied Materials, Inc.
0 cites
US121989442025
Substrate Handling in a Modular Polishing System with Single Substrate Cleaning Chambers
Applied Materials, Inc.
0 cites
US121945912025
Roller for Location-specific Wafer Polishing
Applied Materials, Inc.
0 cites
US121425132024
Wafer Processing Tools and Methods Thereof
Applied Materials, Inc.
0 cites
US121387332024
Roller for Location-specific Wafer Polishing
Applied Materials, Inc.
0 cites
US121285242024
Membrane for Carrier Head with Segmented Substrate Chuck
Applied Materials, Inc.
0 cites
US120768772024
Polishing Platens and Polishing Platen Manufacturing Methods
APPLIED MATERIALS, Inc.
0 cites
US120489812024
Retaining Ring Having Inner Surfaces with Features
Applied Materials, Inc.
0 cites
US120428992024
Polishing Head with Membrane Position Control
Applied Materials, Inc.
0 cites
US120338652024
Retaining Ring Having Inner Surfaces with Facets
Applied Materials, Inc.
0 cites
US119869232024
Polishing Head with Local Wafer Pressure
APPLIED MATERIALS, Inc.
0 cites
US119581642024
Stepped Retaining Ring
Applied Materials, Inc.
0 cites
US119450732024
Dual Membrane Carrier Head for Chemical Mechanical Polishing
Applied Materials, Inc.
0 cites
US119318572024
Deformable Substrate Chuck
Applied Materials, Inc.
0 cites
US119191202024
Polishing System with Contactless Platen Edge Control
Applied Materials, Inc.
0 cites
US119044292024
Substrate Polishing Apparatus with Contact Extension or Adjustable Stop
Applied Materials, Inc.
0 cites
US118907172024
Polishing System with Platen for Substrate Edge Control
Applied Materials, Inc.
0 cites
US118507032023
Method of Forming Retaining Ring with Shaped Surface
Applied Materials, Inc.
0 cites
US117800492023
Polishing Carrier Head with Multiple Angular Pressurizable Zones
Applied Materials, Inc.
0 cites
US117800462023
Polishing System with Annular Platen or Polishing Pad
Applied Materials, Inc.
0 cites
US117599112023
Carrier Head with Segmented Substrate Chuck
Applied Materials, Inc.
0 cites
US117495522023
Wafer Processing Tools and Methods Thereof
Applied Materials, Inc.
0 cites
US117452272023
Substrate Cleaning Devices and Methods Thereof
Applied Materials, Inc.
0 cites
US117243572023
Pivotable Substrate Retaining Ring
Applied Materials, Inc.
0 cites
US117215632023
Non-contact Clean Module
Applied Materials, Inc.
0 cites
US117179362023
Methods for a Web-based CMP System
Applied Materials, Inc.
0 cites
US116825612023
Retaining Ring Having Inner Surfaces with Facets
Applied Materials, Inc.
0 cites
US116607212023
Dual Loading Retaining Ring
Applied Materials, Inc.
0 cites
US116233212023
Polishing Head Retaining Ring Tilting Moment Control
Applied Materials, Inc.
0 cites
US115773612023
Retaining Ring with Shaped Surface and Method of Forming
Applied Materials, Inc.
0 cites