Steven James Sedlock

6 Patents

• US125327912026

  Multi-die Semiconductor Wafer Using Silicon Wafer Substrate Embedment

  Honeywell Federal Manufacturing & Technologies, LLC

  0 cites
• US120628342024

  Radio Frequency Tuning Using a Multichip Module Electrical Interconnect Structure

  Honeywell Federal Manufacturing & Technologies, LLC

  0 cites
• US118801392024

  Photolithography System Including Selective Light Array

  Honeywell Federal Manufacturing & Technologies, LLC

  0 cites
• US118069642023

  Dopant for Improving Casting and Electroplating Performance

  Honeywell Federal Manufacturing & Technologies, LLC

  0 cites
• US118108952023

  Electrical Interconnect Structure Using Metal Bridges to Interconnect Die

  Honeywell Federal Manufacturing & Technologies, LLC

  0 cites
• US118111322023

  Radio Frequency Tuning Using a Multichip Module Electrical Interconnect Structure

  Honeywell Federal Manufacturing & Technologies, LLC

  0 cites