Patents/Inventors

Steve S. Cho

Chandler, AZUS6 patents

7 Patents

US124567052025
First Layer Interconnect First on Carrier Approach for EMIB Patch
Intel Corporation
0 cites
US123622502025
Protruding SN Substrate Features for Epoxy Flow Control
Intel Corporation
0 cites
US123549922025
First Layer Interconnect First on Carrier Approach for EMIB Patch
Intel Corporation
0 cites
US123344532025
Soldered Metallic Reservoirs for Enhanced Transient and Steady-state Thermal Performance
Intel Corporation
0 cites
US120681722024
Sacrificial Pads to Prevent Galvanic Corrosion of FLI Bumps in EMIB Packages
Intel Corporation
0 cites
US120092712024
Protruding SN Substrate Features for Epoxy Flow Control
Intel Corporation
0 cites
US117768642023
Corner Guard for Improved Electroplated First Level Interconnect Bump Height Range
Intel Corporation
0 cites