15 Patents
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- US121388602024Three-dimensional Printing Conductive Elements
Hewlett-packard Development Company, L.P.
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- US119118252024Fusing Electronic Components Into Three-dimensional Objects via Additive Manufacturing Processes
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
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- US117600102023Forming Three-dimensional (3D) Electronic Parts
Hewlett-packard Development Company, L.P.
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- US117330202023First Object for Assembly with a Second Object and Method of Assembly Thereof
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
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