13 Patents
- US124179572025Structure and Method Related to a Power Module Using a Hybrid Spacer
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
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- US119843882024Semiconductor Package Structures and Methods of Manufacture
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
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- US118813982024Semiconductor Device and Method for Supporting Ultra-thin Semiconductor Die
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites - US118429422023Structure and Method Related to a Power Module Using a Hybrid Spacer
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites - US117106862023Semiconductor Package Structures and Methods of Manufacture
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
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