14 Patents
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- US124380872025High Throughput Additive Manufacturing for Integrated Circuit Components Containing Traces with Feature Size and Grain Boundaries
Intel Corporation
0 cites - US124314302025Technologies for High Throughput Additive Manufacturing for Integrated Circuit Components
Intel Corporation
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- US122422902025Integrating Voltage Regulators and Passive Circuit Elements with Top Side Power Planes in Stacked Die Architectures
Intel Corporation
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- US121990122025Modular Microchannel Thermal Solutions for Integrated Circuit Devices
Intel Corporation
0 cites - US121702442024High-throughput Additively Manufactured Power Delivery Vias and Traces
Intel Corporation
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- US116212462023Diffused Bitline Replacement in Stacked Wafer Memory
ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
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