Stephan Stoeckl

5 Patents

• US126047592026

  Microelectronic Assemblies Including Stiffeners Around Individual Dies

  Intel Corporation

  0 cites
• US125640582026

  Packaging Architecture with Reinforcement Structure in Package Substrate

  Intel Corporation

  0 cites
• US125507362026

  Packaging Architecture with Reinforcement Structure in Package Substrate

  Intel Corporation

  0 cites
• US125387972026

  Substrate for Improved Heat Dissipation and Method

  Intel Corporation

  0 cites
• US120574112024

  Stress Relief Die Implementation

  Intel Corporation

  0 cites