3 Patents
- US119787082024Chip or System-in-package Protection Using the GMI Effect
COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
0 cites - US118943152024Electronic System in Package Comprising Protected Side Faces
COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
0 cites - US115575502023Electronic Chip, the Rear Face of Which Is Protected by an Improved Embrittlement Structure
COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
0 cites