Patents/Inventors

Steffen Jordan

PielenhofenDE3 patents

4 Patents

US122887272025
Method of Manufacturing a Package Having an Adhesion Promoter
Infineon Technologies AG
0 cites
US122305472025
Method of Manufacturing a Package Having an Adhesion Promoter
Infineon Technologies AG
0 cites
US118626002024
Method of Forming a Chip Package and Chip Package
Infineon Technologies AG
0 cites
US116520122023
Inorganic Encapsulant for Electronic Component with Adhesion Promoter
Infineon Technologies AG
0 cites