Patents/Inventors

Steffany Ann Lacierda Moreno

BambanPH4 patents

5 Patents

US122666312025
Flip-chip Package Assembly
TEXAS INSTRUMENTS INCORPORATED
0 cites
US121320272024
Semiconductor Device Assembly with Pre-reflowed Solder
TEXAS INSTRUMENTS INCORPORATED
0 cites
US119293082024
Flip Chip Package Assembly
TEXAS INSTRUMENTS INCORPORATED
0 cites
US116370832023
Flip-chip Package Assembly
TEXAS INSTRUMENTS INCORPORATED
0 cites
US116004982023
Semiconductor Package with Flip Chip Solder Joint Capsules
TEXAS INSTRUMENTS INCORPORATED
0 cites