Stefan Woetzel

5 Patents

• US124127972025

  Hybrid Embedded Package

  Infineon Technologies AG

  0 cites
• US122835382025

  Molded Semiconductor Package Having an Embedded Inlay

  Infineon Technologies AG

  0 cites
• US119843922024

  Semiconductor Package Having a Chip Carrier with a Pad Offset Feature

  Infineon Technologies AG

  0 cites
• US117106842023

  Package with Separate Substrate Sections

  Infineon Technologies AG

  0 cites
• US116768792023

  Semiconductor Package Having a Chip Carrier and a Metal Plate Sized Independently of the Chip Carrier

  Infineon Technologies AG

  0 cites