Patents/Inventors

Stefan Miethaner

RegensburgDE2 patents

4 Patents

US122887272025
Method of Manufacturing a Package Having an Adhesion Promoter
Infineon Technologies AG
0 cites
US122305472025
Method of Manufacturing a Package Having an Adhesion Promoter
Infineon Technologies AG
0 cites
US116520122023
Inorganic Encapsulant for Electronic Component with Adhesion Promoter
Infineon Technologies AG
0 cites
US116520842023
Flat Lead Package Formation Method
Infineon Technologies AG
0 cites