Stanley Seungchul Song

6 Patents

• US124009662025

  Package Comprising Integrated Devices and Bridge Coupling Top Sides of Integrated Devices

  QUALCOMM INCORPORATED

  0 cites
• US119730192024

  Deep Trench Capacitors in an Inter-layer Medium on an Interconnect Layer of an Integrated Circuit Die and Related Methods

  QUALCOMM Incorporated

  0 cites
• US118308192023

  Package Comprising Integrated Devices and Bridge Coupling Top Sides of Integrated Devices

  QUALCOMM INCORPORATED

  0 cites
• US116263592023

  Three-dimensional Integrated Circuit (3D IC) Power Distribution Network (PDN) Capacitor Integration

  QUALCOMM Incorporated

  0 cites
• US115520552023

  Integrated Circuit (IC) Packages Employing Front Side Back-end-of-line (FS-BEOL) to Back Side Back-end-of-line (BS-BEOL) Stacking for Three-dimensional (3D) Die Stacking, and Related Fabrication Methods

  QUALCOMM INCORPORATED

  0 cites
• US115455552023

  Gate-all-around (GAA) Transistors with Shallow Source/drain Regions and Methods of Fabricating the Same

  QUALCOMM INCORPORATED

  0 cites