29 Patents
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- US126047442026Integration of Glass Core Into Electronic Substrates for Fine Pitch Die Tiling
Intel Corporation
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- US125123962025Flexible Die to Floor Planning with Bump Pitch Scale Through Glass Core via Pitch
Intel Corporation
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- US124811082025Faraday Rotator Interconnect as a Through-via Configuration in a Patch Architecture
Intel Corporation
0 cites - US124761752025Glass Substrates Having Transverse Capacitors for Use with Semiconductor Packages and Related Methods
Intel Corporation
0 cites - US124226152025Nested Glass Packaging Architecture for Hybrid Electrical and Optical Communication Devices
Intel Corporation
0 cites - US124128682025Microelectronic Assemblies Including Interconnects with Different Solder Materials
Intel Corporation
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- US123477882025Glass Substrates Having Signal Shielding for Use with Semiconductor Packages and Related Methods
Intel Corporation
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- US123006202025Inorganic-based Embedded-die Layers for Modular Semiconductive Devices
Intel Corporation
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- US122180712025Panel Level Packaging for Multi-die Products Interconnected with Very High Density (VHD) Interconnect Layers
Intel Corporation
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- US117988872023Inorganic-based Embedded-die Layers for Modular Semiconductive Devices
Intel Corporation
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- US117441612023Magnetoresistive Stacks with an Unpinned, Fixed Synthetic Anti-ferromagnetic Structure and Methods of Manufacturing Thereof
Everspin Technologies, Inc.
0 cites - US117355312023Panel Level Packaging for Multi-die Products Interconnected with Very High Density (VHD) Interconnect Layers
Intel Corporation
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- US115748742023Package Architecture Utilizing Photoimageable Dielectric (PID) for Reduced Bump Pitch
Intel Corporation
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