Patents/Inventors

Srinivas Pietambaram

Chandler, AZUS50 patents

38 Patents

US126047482026
Capacitor Pads and Methods of Manufacturing the Same
Intel Corporation
0 cites
US125688312026
Patternable Die Attach Materials and Processes for Patterning
Intel Corporation
0 cites
US124496002025
Position Controlled Waveguides and Methods of Manufacturing the Same
Intel Corporation
0 cites
US124446722025
Hybrid Bonding Technologies with Thermal Expansion Compensation Structures
Intel Corporation
0 cites
US123947192025
Methods and Apparatus to Increase Glass Core Thickness
Intel Corporation
0 cites
US123744822025
Carrier Chuck Comprising a Plurality of Magnets and Methods of Forming and Using Thereof
Intel Corporation
0 cites
US123549312025
Optimization for Raster Scanning
Intel Corporation
0 cites
US123344222025
Methods and Apparatus to Reduce Defects in Interconnects Between Semicondcutor Dies and Package Substrates
Intel Corporation
0 cites
US123361972025
In-plane Inductors in IC Packages
Intel Corporation
0 cites
US123083292025
Chiplet First Architecture for Die Tiling Applications
Intel Corporation
0 cites
US122724842025
Coreless Electronic Substrates Having Embedded Inductors
Intel Corporation
0 cites
US122726562025
Heterogeneous Nested Interposer Package for IC Chips
Intel Corporation
0 cites
US122551472025
Electronic Substrate Having an Embedded Etch Stop to Control Cavity Depth in Glass Layers Therein
Intel Corporation
0 cites
US122438252025
Hybrid Conductive Vias for Electronic Substrates
Intel Corporation
0 cites
US122304302025
Substrate Embedded Magnetic Core Inductors and Method of Making
Intel Corporation
0 cites
US122241032025
Angled Inductor with Small Form Factor
Intel Corporation
0 cites
US121990482025
Heterogeneous Nested Interposer Package for IC Chips
Intel Corporation
0 cites
US121912402025
Hybrid Glass Core for Wafer Level and Panel Level Packaging Applications
Intel Corporation
0 cites
US121659942024
Radio Frequency Antennas and Waveguides for Communication Between Integrated Circuit Devices
Intel Corporation
0 cites
US121257932024
Hybrid Fan-out Architecture with EMIB and Glass Core for Heterogeneous Die Integration Applications
Intel Corporation
0 cites
US120876952024
Hybrid Fan-out Architecture with EMIB and Glass Core for Heterogeneous Die Integration Applications
Intel Corporation
0 cites
US119904272024
Chiplet First Architecture for Die Tiling Applications
Intel Corporation
0 cites
US119786852024
Glass Core Patch with in Situ Fabricated Fan-out Layer to Enable Die Tiling Applications
Intel Corporation
0 cites
US119730412024
Chiplet First Architecture for Die Tiling Applications
Intel Corporation
0 cites
US119358572024
Surface Finishes with Low RBTV for Fine and Mixed Bump Pitch Architectures
Intel Corporation
0 cites
US119292122024
Method to Form High Capacitance Thin Film Capacitors (tfcs) as Embedded Passives in Organic Substrate Packages
Intel Corporation
0 cites
US119233122024
Patternable Die Attach Materials and Processes for Patterning
Intel Corporation
0 cites
US118626192024
Patch Accommodating Embedded Dies Having Different Thicknesses
Intel Corporation
0 cites
US118551252023
Capacitors with Nanoislands on Conductive Plates
Intel Corporation
0 cites
US118240182023
Heterogeneous Nested Interposer Package for IC Chips
0 cites
US118173492023
Conductive Route Patterning for Electronic Substrates
Intel Corporation
0 cites
US117802102023
Glass Dielectric Layer with Patterning
Intel Corporation
0 cites
US117697352023
Chiplet First Architecture for Die Tiling Applications
Intel Corporation
0 cites
US117568902023
Hybrid Fan-out Architecture with EMIB and Glass Core for Heterogeneous Die Integration Applications
Intel Corporation
0 cites
US117355332023
Heterogeneous Nested Interposer Package for IC Chips
Intel Corporation
0 cites
US117282652023
Selective Deposition of Embedded Thin-film Resistors for Semiconductor Packaging
Intel Corporation
0 cites
US116224482023
Sandwich-molded Cores for High-inductance Architectures
Intel Corporation
0 cites
US115749932023
Package Architecture with Tunable Magnetic Properties for Embedded Devices
Intel Corporation
0 cites