Sridhar Muthrasanallur

4 Patents

• US125783842026

  Unified Test and Debug Chiplet Architecture

  Intel Corporation

  0 cites
• US125050652025

  On-package Die-to-die (D2D) Interconnect for Memory Using Universal Chiplet Interconnect Express (ucie) PHY

  Intel Corporation

  0 cites
• US124990192025

  Retimers to Extend a Die-to-die Interconnect

  Intel Corporation

  0 cites
• US123609342025

  Parameter Exchange for a Die-to-die Interconnect

  Intel Corporation

  0 cites