20 Patents
- US124811082025Faraday Rotator Interconnect as a Through-via Configuration in a Patch Architecture
Intel Corporation
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- US122180712025Panel Level Packaging for Multi-die Products Interconnected with Very High Density (VHD) Interconnect Layers
Intel Corporation
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- US119358572024Surface Finishes with Low RBTV for Fine and Mixed Bump Pitch Architectures
Intel Corporation
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- US119088212024Sacrificial Dielectric for Lithographic via Formation to Enable via Scaling in High Density Interconnect Packaging
Intel Corporation
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- US118943242024In-package RF Waveguides as High Bandwidth Chip-to-chip Interconnects and Methods for Using the Same
Intel Corporation
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- US117641582023Embedded Multi-die Interconnect Bridge Packages with Lithographically Formed Bumps and Methods of Assembling Same
Intel Corporation
0 cites - US117355312023Panel Level Packaging for Multi-die Products Interconnected with Very High Density (VHD) Interconnect Layers
Intel Corporation
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- US115748742023Package Architecture Utilizing Photoimageable Dielectric (PID) for Reduced Bump Pitch
Intel Corporation
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