15 Patents
- 0 cites
- US125869062026Antenna Package Using Ball Attach Array to Connect Antenna and Base Substrates
Intel Corporation
0 cites - 0 cites
- 0 cites
- 0 cites
- US121320152024Package Embedded Magnetic Inductor Structures and Manufacturing Techniques for 5-50 MHZ SMPS Operations
Intel Corporation
0 cites - 0 cites
- US120339302024Selectively Roughened Copper Architectures for Low Insertion Loss Conductive Features
Intel Corporation
0 cites - US118698422024Scalable High Speed High Bandwidth IO Signaling Package Architecture and Method of Making
Intel Corporation
0 cites - US118701632024Antenna Package Using Ball Attach Array to Connect Antenna and Base Substrates
Intel Corporation
0 cites - 0 cites
- 0 cites
- US117216322023Hybrid Core Substrate Architecture for High Speed Signaling and FLI/SLI Reliability and Its Making
Intel Corporation
0 cites - 0 cites
- 0 cites