Patents/Inventors

Sreenivasan K. Koduri

Dallas, TXUS31 patents

30 Patents

US125052682025
Automated Geometry Optimization for Analog, Mixed-signal Circuit Design
TEXAS INSTRUMENTS INCORPORATED
0 cites
US125060972025
Expanded Head Pillar for Bump Bonds
TEXAS INSTRUMENTS INCORPORATED
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US124890672025
Industrial Chip Scale Package for Microelectronic Device
TEXAS INSTRUMENTS INCORPORATED
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US124190632025
Inductor on Microelectronic Die
TEXAS INSTRUMENTS INCORPORATED
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US124009452025
Electronic Device Multilevel Package Substrate for Improved Electromigration Performance
TEXAS INSTRUMENTS INCORPORATED
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US122993642025
Multi-algorithmic Approach to Represent Highly Non-linear High Dimensional Space
TEXAS INSTRUMENTS INCORPORATED
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US123006782025
Package for Power Semiconductor Devices
Texas Instruments Incorporated
0 cites
US122305942025
Printed Package and Method of Making the Same
TEXAS INSTRUMENTS INCORPORATED
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US121912732025
Pre-molded Leadframes in Semiconductor Devices
TEXAS INSTRUMENTS INCORPORATED
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US121837032024
Leadframes in Semiconductor Devices
TEXAS INSTRUMENTS INCORPORATED
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US121779882024
Wafer Level Bump Stack for Chip Scale Package
TEXAS INSTRUMENTS INCORPORATED
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US120740982024
Three-dimensional Functional Integration
TEXAS INSTRUMENTS INCORPORATED
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US120664592024
Integrated Circuit Package with Current Sense Element
TEXAS INSTRUMENTS INCORPORATED
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US119786992024
Electronic Device Multilevel Package Substrate for Improved Electromigration Preformance
TEXAS INSTRUMENTS INCORPORATED
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US118879062024
Packaged Device with Die Wrapped by a Substrate
TEXAS INSTRUMENTS INCORPORATED
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US118307932023
Multi-lead Adapter
TEXAS INSTRUMENTS INCORPORATED
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US118108432023
Integrated Capacitor with Extended Head Bump Bond Pillar
Texas Instruments Incorporated
0 cites
US117977322023
Automated Analog and Mixed-signal Circuit Design and Validation
TEXAS INSTRUMENTS INCORPORATED
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US117569142023
Microelectronic Device with Pillars Having Flared Ends
TEXAS INSTRUMENTS INCORPORATED
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US117485332023
Programmatic Circuit Partitioning and Topology Identification
TEXAS INSTRUMENTS INCORPORATED
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US117496162023
Industrial Chip Scale Package for Microelectronic Device
TEXAS INSTRUMENTS INCORPORATED
0 cites
US117271752023
Automated Analog and Mixed-signal Circuit Design and Validation
TEXAS INSTRUMENTS INCORPORATED
0 cites
US117054142023
Structure and Method for Semiconductor Packaging
TEXAS INSTRUMENTS INCORPORATED
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US116949472023
Multi-pitch Leads
Texas Instruments Incorporated
0 cites
US116826092023
Three-dimensional Functional Integration
TEXAS INSTRUMENTS INCORPORATED
0 cites
US116768842023
Cantilevered Leadframe Support Structure for Magnetic Wireless Transfer Between Integrated Circuit Dies
TEXAS INSTRUMENTS INCORPORATED
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US116769512023
Package for Power Semiconductor Devices
TEXAS INSTRUMENTS INCORPORATED
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US116409682023
Inductor on Microelectronic Die
TEXAS INSTRUMENTS INCORPORATED
0 cites
US116362422023
Process Aware Compact Representation of Integrated Circuits
TEXAS INSTRUMENTS INCORPORATED
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US115733242023
Lidar Imaging Receiver
TEXAS INSTRUMENTS INCORPORATED
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