Patents/Inventors

Soyoun Lee

Hwaseong-siKR2 patents

3 Patents

US117913082023
Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US117641922023
Semiconductor Package Including Underfill Material Layer and Method of Forming the Same
Samsung Electronics Co., Ltd.
0 cites
US117216732023
Semiconductor Package Having Stacked Semiconductor Chips
SAMSUNG ELECTRONICS CO., Ltd.
0 cites