Patents/Inventors

Soungsoo Kim

BerlinDE1 patent

2 Patents

US124395282025
Method of Preparing a High Density Interconnect Printed Circuit Board Including Microvias Filled with Copper
Atotech Deutschland GmbH & Co. KG
0 cites
US122453832025
Method of Preparing a High Density Interconnect Printed Circuit Board Including Microvias Filled with Copper
Atotech Deutschland GmbH & Co. KG
0 cites