Patents/Inventors

Sorin Dinescu

Temecula, CAUS1 patent

2 Patents

US120856092024
Thermal Control Wafer with Integrated Heating-sensing Elements
AEM Singapore Pte. Ltd.
0 cites
US120134322024
Thermal Control Wafer with Integrated Heating-sensing Elements
AEM Singapore Pte. Ltd.
0 cites