Patents/Inventors

Soon Wei Wang

SerembanMY10 patents

11 Patents

US124446092025
Silicon-on-insulator Die Support Structures and Related Methods
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US124245222025
Leadless Semiconductor Packages, Leadframes Therefor, and Methods of Making
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US123745542025
Semiconductor Packages with Die Including Cavities and Related Methods
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US123745552025
Die Sidewall Coatings and Related Methods
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US122438102025
Semiconductor Package with Wettable Flank and Related Methods
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US121762722024
Semiconductor Package with Wettable Flank
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US120401922024
Die Sidewall Coatings and Related Methods
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US119086992024
Semiconductor Packages with Die Including Cavities
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US119011842024
Backmetal Removal Methods
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US118942342024
Semiconductor Packages with Die Support Structure for Thin Die
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US117216542023
Ultra-thin Multichip Power Devices
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites