4 Patents
- US124701852025Semiconductor Device Packages with Exposed Heat Dissipating Surfaces and Methods of Fabricating the Same
Wolfspeed, Inc.
0 cites - US124514132025Packaged Semiconductor Devices with Leadframes Having Tie Bar with Recessed Cavity
MACOM Technology Solutions Holdings, Inc.
0 cites - US121192392024Packaged Semiconductor Devices, and Package Molds for Forming Packaged Semiconductor Devices
Wolfspeed, Inc.
0 cites - US120092862024Methods of Forming Packaged Semiconductor Devices and Leadframes for Semiconductor Device Packages
MACOM Technology Solutions Holdings, Inc.
0 cites