6 Patents
- 0 cites
- US122794152025Method of Fabricating Semiconductor Memory Device Having Protruding Contact Portion
Samsung Electronics Co., Ltd.
0 cites - US120806632024Semiconductor Devices Including a Thick Metal Layer and a Bump
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - US118174082023Semiconductor Devices Including a Thick Metal Layer and a Bump
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - US117231912023Semiconductor Memory Devices Having Protruding Contact Portions
Samsung Electronics Co., Ltd.
0 cites - US115575562023Semiconductor Devices Including a Thick Metal Layer and a Bump
SAMSUNG ELECTRONICS CO., Ltd.
0 cites