4 Patents
- US126160142026Semiconductor Device Including a Through Electrode Contacting a Backside Conductive Pattern and a Frontside Conductive Pattern and a Semiconductor Package Including the Same
Samsung Electronics Co., Ltd.
0 cites - US121660002024Semiconductor Device Including a Lower Chip Including a Peripheral Circuit and First and Second Memory Chips Vertically Stacked Thereon and Data Storage System Including the Same
Samsung Electronics Co., Ltd.
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